Jupiter Design Technologies specialized in the manufacture of a wide range of board types. The company’s emphasis on R&D has helped Jupiter become a market leader in the development and manufacturing of next-generation PCBs.

Jupiter utilizes a variety of technologies in board manufacturing, which include:-
     •  Blind and Buried via Technology
     •  Micro via Technology
     •  "Bookbinder” Rigid-Flex Technology
     •  SMT and BGA Technology
     •  Backplane Technology
     •  RF and Microwave Technology

The company manufactures a wide range of board types including:-
     •  Rigid up to 40 layers
     •  Flex and rigid-flex up to 28 layers
     •  Metal core boards: Copper, Aluminum, Copper Invar Copper
     •  Boards with heave sinks: Copper and Aluminum (2D or 3D)

     •  MIL-PRF-55110 Type 2- for GY
     •  MIL-PRF-55100 Type-3- for GF, GI, GM, BI, RO 4003
     •  Mil-P50884 Type-4 – for rigid-flex (adhesive and adhesiveless)
     •  UL approval 94-V-0- for double sided, Multi-layers and rigid-flex, AP and Adhesivless
         based product.

Manufacturing of PCBs

High Frequency Board

Mixed Signal Board

High Speed BGA Technology